HYS72T256000ER Datasheet, PDF (4/33 Pages) Qimonda AG – 240-Pin Registered DDR2 SDRAM Modules

Internet Data Sheet
HYS72T256000ER-[3.7/5]-B
Registerd DDR2 SDRAM Module
1.2
Description
The QIMONDA HYS72T256000ER-[3.7/5]-B module family
are Registered DIMM modules “RDIMMs” with 30 mm height
based on DDR2 technology. DIMMs are available ECC
modules in 256M × 72 (2 GB) organization and density,
intended for mounting into 240-pin connector sockets.
The memory array is designed with 1-Gbit Double-Data-Rate-
Two (DDR2) Synchronous DRAMs. All control and address
signals are re-driven on the DIMM using register
devices and a PLL for the clock distribution. This
reduces capacitive loading to the system bus, but adds
one cycle to the SDRAM timing. Decoupling capacitors
are mounted on the PCB board. The DIMMs feature serial
presence detect based on a serial E²PROM device using the
2-pin I²C protocol. The first 128 bytes are programmed with
configuration data and are write protected; the second
128 bytes are available to the customer.
Product Type¹⁾
Compliance Code²⁾
TABLE 2
Ordering Information for RoHS Compliant Products
Description
SDRAM
Technology
PC2–4200
HYS72T256000ER–3.7–B 2 GB 1R×4 PC2–4200R–444–12–H0
1 Ranks, ECC
1 Gbit (×4)
PC2–3200
HYS72T256000ER–5–B
2 GB 1R×4 PC2–3200R–333–12–H0
1 Ranks, ECC
1 Gbit (×4)
1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS72T256000ER–3.7–B, indicating Rev.
“B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of this data
sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200R–444–12–H0”, where
4200R means Unbuffered DIMM modules with 4.26 GB/sec Module Bandwidth and “444-12” means Column Address Strobe (CAS)
latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2 and
produced on the Raw Card “H”.
DIMM
Density
2 GByte
Module
Organization
256M × 72
Memory
Ranks
1
ECC/
Non-ECC
ECC
TABLE 3
Address Format
# of SDRAMs # of row/bank/column
bits
Raw
Card
18
14/3/11
H
Product Type¹⁾
DRAM Components¹⁾
DRAM Density
TABLE 4
Components on Modules
DRAM Organisation Note²⁾
HYS72T256000ER
HYB18T1G400BF
1 Gbit
256M × 4
1) Green Product
2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet.
Rev. 1.0, 2006-10
4
10202006-EHWJ-OT02