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CM200HG-130H Datasheet, PDF (3/5 Pages) Mitsubishi Electric Semiconductor – HVIGBT MODULES HIGH POWER SWITCHING USE INSULATED TYPE | |||
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Powerex, Inc., 200 E. Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
CM200HG-130H
Single IGBTMOD⢠HVIGBT Module
200 Amperes/6500 Volts
Static Electrical Characteristics, Tj = 25 °C unless otherwise speciï¬ed
Characteristics
Symbol
Test Conditions
Min.
Collector-Cutoff Current*
ICES
VCE = VCES, VGE = 0V, Tj = 25°C
â
VCE = VCES, VGE = 0V, Tj = 125°C
â
Gate-Emitter Threshold Voltage
VGE(th)
IC = 20mA, VCE = 10V
5.0
Gate Leakage Current
IGES
VGE = VGES, VCE = 0V
â
Collector-Emitter Saturation Voltage
VCE(sat)
IC = 200A, VGE = 15V, Tj = 25°C
â
IC = 200A, VGE = 15V, Tj = 125°C
â
Input Capacitance
Cies
VCE = 10V, VGE = 0V,
â
Output Capacitance
Coes
f = 100kHz,
â
Reverse Transfer Capacitance
Cres
Tj = 25°C
â
Total Gate Charge
QG
VCC = 3600V, IC = 200A, VGE = 15V
â
Emitter-Collector Voltage**
VEC
IE = 200A, VGE = 0V, Tj = 25°C
â
IE = 200A, VGE = 0V, Tj = 125°C
â
Turn-On Delay Time
td(on)
VCC = 3600V, IC = 200A,
â
Turn-On Rise Time
tr
VGE1 = -VGE2 = 15V, RG(on) = 30Ω,
â
Turn-On Switching Energy
Eon
Tj = 125°C, toff = 60µs, Inductive Load
â
Turn-Off Delay Time
td(off)
VCC = 3600V, IC = 200A,
â
Turn-Off Fall Time 1
tf1
VGE1 = -VGE2 = 15V,
â
Turn-Off Fall Time 2
tf2
RG(off) = 72Ω,
â
Turn-Off Switching Energy
Eoff
Tj = 125°C, toff = 60µs, Inductive Load
â
Reverse Recovery Time 1**
trr1
VCC = 3600V, IE = 200A,
â
Reverse Recovery Time 2**
trr2
die/dt = -670A/μs,
â
Reverse Recovery Charge**
Qrr
Tj = 125°C,
â
Reverse Recovery Energy**
Erec
toff = 60µs, Inductive Load
â
* Pulse width and repetition rate should be such that device junction temperature rise is negligible.
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
Thermal Characteristics, Tj = 25 °C unless otherwise speciï¬ed
Characteristics
Symbol
Test Conditions
Min.
Thermal Resistance, Junction to Case
Rth(j-c) Q
Per IGBT
â
Thermal Resistance, Junction to Case
Rth(j-c) D
Per FWDi
â
Contact Thermal Resistance, Case to Fin
Rth(c-f)
Per Module, Thermal Grease Applied
â
Mechanical Characteristics, Tj = 25 °C unless otherwise speciï¬ed
Characteristics
Symbol
Test Conditions
Min.
Comparative Tracking Index
CTI
â
600
Clearance
â
â
26.0
Creepage Distance
â
â
56.0
Internal Inductance
LC-E(int)
â
â
Internal Lead Resistance
RC-E(int)
â
â
Typ.
Max. Units
â
3.0
mA
10
30.0
mA
6.0
7.0
Volts
â
0.5
µA
5.1
â
Volts
5.0
â
Volts
41.0
â
nF
2.5
â
nF
0.7
â
nF
3.3
â
µC
4.0
â
Volts
3.6
â
Volts
1.2
â
µs
0.35
â
µs
1.5
â
J/P
6.6
â
µs
0.5
â
µs
3.3
â
µs
1.2
â
J/P
1.0
â
µs
2.4
â
µs
370
â
µC
0.7
â
J/P
Typ.
Max. Units
â
42.0 K/kW
â
66.0 K/kW
18.0
â
K/kW
Typ.
â
â
â
54.0
â
Max.
â
â
â
â
â
Units
â
mm
mm
µH
mΩ
8/05
3
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