BU505F Datasheet, PDF (9/12 Pages) NXP Semiconductors – Silicon diffused power transistors

Philips Semiconductors
Silicon diffused power transistors
PACKAGE OUTLINE
Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3 lead TO-220 exposed tabs
Product specification
BU505F; BU505DF
SOT186
E
E1
A
P
m
A1
q
D1
D
L1
L
b1
L2
123
b
e
e1
wM
Q
c
0
5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A1 b b1 c
D D1 E E1
e
e1
L L1⁽¹⁾ L2
mm ^4.4
4.0
2.9
2.5
0.9
0.7
1.5 0.55 17.0 7.9 10.2
1.3 0.38 16.4 7.5 9.6
5.7
5.3
2.54
5.08
14.3
13.5
4.8
4.0
10
Note
1. Terminal dimensions within this zone are uncontrolled. Terminals in this zone are not tinned.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT186
TO-220
mP Q q w
0.9
0.5
3.2
3.0
1.4
1.2
4.4
4.0
0.4
EUROPEAN
PROJECTION
ISSUE DATE
97-06-11
1997 Aug 13
9