BUK218-50DY Datasheet, PDF (8/9 Pages) NXP Semiconductors – TOPFET dual high side switch

Philips Semiconductors
TOPFET dual high side switch
MECHANICAL DATA
Plastic single-ended surface mounted package (Philips version of D²-PAK);
7 leads (one lead cropped)
Product specification
BUK218-50DY
SOT427
E
D1
D
HD
4
1
7
b
e e eee e
A
A1
mounting
base
Lp
c
Q
0
2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
c
D
max.
D1
E
e
mm ^{4.50 1.40 0.85 0.64}
4.10 1.27 0.60 0.46
11
1.60 10.30 _1.27
1.20 9.70
Lp
HD
Q
2.90 15.80 2.60
2.10 14.80 2.20
OUTLINE
VERSION
IEC
SOT427
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
99-06-25
01-04-18
Fig.4. SOT427 surface mounting package¹, centre pin connected to mounting base.
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
May 2001
8
Rev 1.400