BAS56_15 Datasheet, PDF (8/12 Pages) Central Semiconductor Corp – HIGH CURRENT SILICON SWITCHING DIODES

NXP Semiconductors
11. Soldering
BAS56
High-speed double diode
0.7 0.6
(3×) (3×)
3.25
0.6
(3×)
0.5
(3×)
1.9
23
0.7 0.6
0.75
0.95
0.9
1
Fig 9. Reflow soldering footprint BAS56 (SOT143B)
4.45
2.2
1.2
(3×)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot143b_fr
4.6 2.575
1.425
(3×)
1.425
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
1
1.2
sot143b_fw
Fig 10. Wave soldering footprint BAS56 (SOT143B)
BAS56
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 June 2010
© NXP B.V. 2010. All rights reserved.
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