BU506 Datasheet, PDF (7/12 Pages) NXP Semiconductors – Silicon diffused power transistors

Philips Semiconductors
Silicon diffused power transistors
Product specification
BU506; BU506D
PACKAGE OUTLINE
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220
SOT78
E
P
q
D1
D
L2⁽¹⁾
L1
b1
L
123
b
ee
A
A1
Q
c
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
b1
c
D
D1
E
e
mm
4.5
4.1
1.39
1.27
0.9
0.7
1.3
1.0
0.7
0.4
15.8
15.2
6.4
5.9
10.3
9.7
2.54
Note
1. Terminals in this zone are not tinned.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT78
TO-220
L
15.0
13.5
L1
3.30
2.79
L2⁽¹⁾
max.
3.0
P
q
Q
3.8 3.0 2.6
3.6 2.7 2.2
EUROPEAN
PROJECTION
ISSUE DATE
97-06-11
1997 Aug 13
6