BTA208S-600D Datasheet, PDF (6/14 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
BTA208S-600D
3Q Hi-Com Triac
8. Thermal characteristics
Table 5.
Symbol
R_th(j-mb)
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
Conditions
full cycle; Fig. 6
half cycle; Fig. 6
printed circuit board (FR4) mounted
10
Z_th(j-mb)
(K/W)
1
unidirectional
bidirectional
10^{- 1}
Min Typ Max Unit
-
-
2
K/W
-
-
2.4 K/W
-
75
-
K/W
003aaf584
P
10^{- 2}
10^{- 5}
10^{- 4}
10^{- 3}
10^{- 2}
10^{- 1}
tp
t
1
10
t_p (s)
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width
BTA208S-600D
Product data sheet
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11 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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