BTA208S-600D Datasheet, PDF (10/14 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
10. Package outline
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
BTA208S-600D
3Q Hi-Com Triac
SOT428
y
E
A
A
see Note 1
b₂
A₁
E₁
mounting
base
D₂
D₁
H_D
L₂
b₁
2
1
L
3
b
e
e₁
wA
L₁
c
0
5
10 mm
scale
Dimensions (mm are the original dimensions)
Unit
A A₁ b b₁ b₂ c D₁ D₂ E E₁ e e₁ H_D L L₁ L₂ w y
max 2.38 0.93 0.89 1.1 5.46 0.56 6.22
6.73
10.4 2.95
0.9
0.2
mm nom
2.285 4.57
0.2
min 2.22 0.46 0.71 0.9 5.00 0.20 5.98 4.0 6.47 4.45
9.6 2.55 0.5 0.5
Note
1. Plastic body may have 45° chamfer.
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT428
TO-252
SC-63
Fig. 13. Package outline DPAK (SOT428)
sot428_po
Issue date
06-03-16
14-06-10
BTA208S-600D
Product data sheet
All information provided in this document is subject to legal disclaimers.
11 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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