BTA208S-600D Datasheet, PDF (11/14 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
11. Soldering
Footprint information for reflow soldering of DPAK (SOT428) package
BTA208S-600D
3Q Hi-Com Triac
SOT428
1
4.6
5.75 5.65
1.15
3.6
2.45
6
2.4 2.3
7
6.15
5.9
5.8
1.8
4.725
6.5
6
6.125
0.3
1.5
1.3
1.4
1.65
4.57
occupied area
solder resist
solder lands
solder paste
Dimensions in mm
Issue date
14-03-12
14-03-17
Fig. 14. Reflow soldering footprint for DPAK (SOT428)
BTA208S-600D
Product data sheet
All information provided in this document is subject to legal disclaimers.
11 August 2014
sot428_fr
© NXP Semiconductors N.V. 2014. All rights reserved
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