SA1620 Datasheet, PDF (5/26 Pages) NXP Semiconductors – Low voltage GSM front-end transceiver

Philips Semiconductors
Low voltage GSM front-end transceiver
Product specification
SA1620
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
RATING
UNITS
V_CCXX
V_BATT
V_IN
∆V
∆VG
Supply voltages
Battery voltage
Voltage applied to any other pin
V_CCTx1,2 pins to V_CCBM
Any GND pin to any other GND pin
-0.3 to +6.0
V
-0.3 to +8.0
V
-0.3 to (V_CCXX+0.3)
V
-0.3 to +1
V
0
V
P_D
Power dissipation, T_A = 25°C (still air)
800
mW
T_JMAX
Maximum operating junction temperature
150
°C
P_MAX
Maximum power input/output
+20
dBm
T_STG
Storage temperature range
–65 to +150
°C
V_TXO, V_TXOX Positive RF peak voltage at Tx outputs
6
V
V_RXIF, V_RXIFX Positive IF peak voltage at Rx mixer outputs
6
V
NOTE:
1. Maximum junction temperature is determined by the power dissipation is determined by the operating ambient temperature and the thermal
resistance, θ_JA. 48-pin TQFP: θ_JA = 67°C/W.
DC REGULATORS
Two low drop regulators (REG1 and REG2) are included on the chip
and may be used to deliver the supply voltage of the main circuitry
(e.g., 3V) out of the battery (at V_BATT = 3.3 to 7.5V) as shown in
Figure 4 and in Table 1.
REG1 is intended to supply, at least, the internal functions of the
SA1620. Both regulators may also be used for external circuitry.
For this application, different voltages may be programmed as
shown in Table 1.
The transmitter supply pins (V_CCTx1,2) also operate as a sensor
connection in the feedback loop of REG1 and must be externally
connected to pin VREG1. For REG2, the sensor pin VREGF2 must
be connected to VREG2.
All ground pins are internally bonded to the header except for pins
GNDL1, GNDREG1 and GNDREG2.
When both regulators are not used, connect pins V_BATT, PON,
CON1, CON2, VREG1, VREG2 and VREG2F2 to ground.
Table 1. DC Reg Output Voltage Control Pins
CON1 CON2
VREG1
VREG2
UNITS
L
L
3 ± 5%
3 ± 5%
V
L
H
3.4 ± 5%
3.4 ± 5%
V
H
L
3.7 ± 5%
3.7 ± 5%
V
H
H
5.1 ± 5%
5.1 ± 10%
V
NOTES:
1. Logic levels at CON1 and CON2:
H – Open circuit. Pin must not be connected externally.
Logic high level supplied on chip.
L – Connected to ground.
2. Currents at CON1 and CON2:
H – 0µA
L (PON = H) – 50µA
L (PON = L) – <1µA
1997 May 22
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