BUK7607-55B_15 Datasheet, PDF (5/14 Pages) NXP Semiconductors – N-channel TrenchMOS standard level FET

NXP Semiconductors
BUK7607-55B
N-channel TrenchMOS standard level FET
5. Thermal characteristics
Table 5.
Symbol
R_th(j-mb)
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to mounting base
thermal resistance from
junction to ambient
Conditions
see Figure 4
minimum footprint; mounted on
a printed-circuit board
Min Typ Max Unit
-
-
0.74 K/W
-
50
-
K/W
03nn67
1
Z_th(j-mb)
(K/W)
δ = 0.5
0.2
10^{-1 0.1}
0.05
0.02
10^-2
P
t_p
δ=
T
single shot
10^-3
10^-6
10^-5
10^-4
10^-3
10^-2
t_p
T
10^-1
t_p (s)
t
1
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
BUK7607-55B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 July 2011
© NXP B.V. 2011. All rights reserved.
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