SAA8112HL Datasheet, PDF (33/40 Pages) NXP Semiconductors – Digital camera signal processor and microcontroller

Philips Semiconductors
Digital camera signal processor and
microcontroller
14 PACKAGE OUTLINE
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
Product specification
SAA8112HL
SOT407-1
y
75
76
X
51
50
ZE
c
A
e
E ^HE
wM
b_p
A ^A2
A₁
100
1
pin 1 index
e
wM
b_p
D
HD
26
25
ZD
vM A
B
vM B
detail X
(A ₃)
θ
L_p
L
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT _max. A₁ A₂ A₃ b_p
c D⁽¹⁾ E⁽¹⁾ e
H_D H_E L
L_p
v
w
y Z_D ⁽¹⁾ Z_E ⁽¹⁾ θ
mm
1.6
0.20
0.05
1.5
1.3
0.25
0.28
0.16
0.18
0.12
14.1
13.9
14.1
13.9
0.5
16.25 16.25
15.75 15.75
1.0
0.75
0.45
0.2
0.12
0.1
1.15 1.15
0.85 0.85
7^o
0^o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT407-1
REFERENCES
JEDEC
EIAJ
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
97-08-04
99-12-27
2000 Jan 18
33