TDA8924 Datasheet, PDF (31/35 Pages) NXP Semiconductors – 2 x 120 W class-D power amplifier

Philips Semiconductors
2 × 120 W class-D power amplifier
17 PACKAGE OUTLINE
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
Objective specification
TDA8924
SOT566-3
D
y
D1
1
pin 1 index
24
Z
e
E
x
c
E2
HE
A
X
vM A
D2
12
E1
13
wM
bp
A2
A4
detail X
Q
A
(A3)
θ
Lp
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A2
A3 A4⁽¹⁾
bp
c D⁽²⁾ D1 D2 E⁽²⁾ E1 E2
e
HE Lp
Q
vw x
y
Z
θ
mm 3.5
3.5
3.2
0.35
+0.08
−0.04
0.53
0.40
0.32 16.0
0.23 15.8
13.0
12.6
1.1
0.9
11.1
10.9
6.2
5.8
2.9
2.5
1
14.5 1.1
13.9 0.8
1.7
1.5
0.25 0.25 0.03 0.07
2.7
2.2
8°
0°
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT566-3
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
03-02-18
03-07-23
2003 Jul 28
31