TDA8924 Datasheet, PDF (21/35 Pages) NXP Semiconductors – 2 x 120 W class-D power amplifier

Philips Semiconductors
2 × 120 W class-D power amplifier
Objective specification
TDA8924
16.11 Reference design: bill of materials
Table 1 Single-chip class-D audio amplifier printed-circuit board (version 4; 01-2002) for TDA8924TH
(see Figs 9 and 10)
BOM
ITEM
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
QUANTITY
REFERENCE
1
U1
2
in1 and in2
2
out1 and out2
1
V_DD, GND and V_SS
2
L5 and L6
4
L1, L2, L3 and L4
1
S1
1
Z1
2
C1 and C2
3
C3, C4 and C5
6
C16, C17, C18 and C19
9
C8, C9, C11, C14, C28,
C29, C32, C35 and C38
10
C6, C7, C10, C12, C13,
C15, C34, C36, C37 and
C39
2
C20 and C21
4
C22, C23, C30 and C31
2
C24, C25
1
C33
2
R3 and R4
1
R5
1
R1
1
R2
4
R6, R7, R8 and R9
2
R12 and R13
2
R10 and R11
2
C26 and C27
1
heatsink
1
printed-circuit board
material
PART
TDA8924TH
cinch inputs
output connector
supply connector
10 µH
BEAD
PCB switch
5V6
470 µF; 35 V
47 µF; 63 V
470 nF; 63 V
220 nF; 63 V
100 nF; 50 V
DESCRIPTION
Philips Semiconductors B.V.
Farnell 152-396
Augat 5KEV-02
Augat 5KEV-03
EP13 or 16RHBP (TOKO);
note 1
Murata BL01RN1-A62
Knitter ATE1E M-O-M
BZX 79C5V6 DO-35
Panasonic M series
ECA1VM471
Panasonic NHG series
ECA1JHG470
MKT EPCOS B32529- 0474- K
SMD 1206
SMD 0805
330 pF; 50 V
SMD 0805
15 nF; 50 V
SMD 0805
560 pF; 100 V
SMD 0805
47 pF; 25V
SMD 0805
39 kΩ; 0.1 W
SMD 0805
30 kΩ; 0.1 W
SMD 1206
10 kΩ; 0.1 W; optional
SMD 0805
9.1 kΩ; 0.1 W; optional
SMD 0805
5.6 kΩ; 0.1 W
SMD 0805
22 Ω; 1 W
SMD 2512
4.7 Ω; 0.25 W
SMD 1206
1 µF; 63V
MKT
SK 174 50 mm (5 K/W) Fisher elektronik
1.6 mm thick epoxy FR4 material, dual-sided 35 µm copper;
clearances 300 µm; minimum copper track 400 µm
Note
1. EP13 or 16RHBP inductors have been used in the first demo boards. In these boards, they functioned properly.
However current rating basically is too low. A better choice is the new TOKO DASM 998AM-105 inductor.
2003 Jul 28
21