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TDA8924 Datasheet, PDF (3/35 Pages) NXP Semiconductors – 2 x 120 W class-D power amplifier | |||
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Philips Semiconductors
2 à 120 W class-D power ampliï¬er
Objective speciï¬cation
TDA8924
1 FEATURES
⢠High efficiency (â¼90 %)
⢠Operating voltage from ±12.5 V to ±30 V
⢠Very low quiescent current
⢠Low distortion
⢠Usable as a stereo Single-Ended (SE) amplifier or as a
mono amplifier in Bridge-Tied Load (BTL)
⢠Fixed gain of 28 dB in SE and 34 dB in BTL
⢠High output power
⢠Good ripple rejection
⢠Internal switching frequency can be overruled by an
external clock
⢠No switch-on or switch-off plop noise
⢠Short-circuit proof across the load and to the supply
lines
⢠Electrostatic discharge protection
⢠Thermally protected.
2 APPLICATIONS
⢠Television sets
⢠Home-sound sets
⢠Multimedia systems
⢠All mains fed audio systems
⢠Car audio (boosters).
3 GENERAL DESCRIPTION
The TDA8924 is a high efficiency class-D audio power
amplifier with very low dissipation. The typical output
power is 2 Ã 120 W.
The device comes in a HSOP24 power package with a
small internal heatsink. Depending on supply voltage and
load conditions a very small or even no external heatsink
is required. The amplifier operates over a wide supply
voltage range from ±12.5 V to ±30 V and consumes a very
low quiescent current.
4 QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
General; VP = ±24 V
VP
Iq(tot)
η
supply voltage
total quiescent current
efï¬ciency
Stereo single-ended conï¬guration
no load connected; note 1
Po = 240 W BTL mode
±12.5 ±24 ±30 V
â
100 â
mA
â
83
â
%
Po
output power
RL = 2 â¦; THD = 10 %; VP = ±24 V; note 2 â
120 â
W
Mono bridge-tied load conï¬guration
Po
output power
RL = 4 â¦; THD = 10 %; note 2
VP = ±24 V
VP = ±20 V
â
240 â
W
â
175 â
W
Notes
1. Quiescent current in application; value strongly depends on circuitry connected to the output pin. This also means
that quiescent dissipation of the chip is lower than the VP Ã Iq.
2. Output power is measured indirectly; based on RDSon measurement.
5 ORDERING INFORMATION
TYPE
NUMBER
TDA8924TH
NAME
HSOP24
PACKAGE
DESCRIPTION
plastic thermal enhanced small outline package; 24 leads; low
stand-off height; heatsink
VERSION
SOT566-3
2003 Jul 28
3
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