TDA8924 Datasheet, PDF (2/35 Pages) NXP Semiconductors – 2 x 120 W class-D power amplifier

Philips Semiconductors
2 × 120 W class-D power amplifier
Objective specification
TDA8924
CONTENTS
1
2
3
4
5
6
7
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.4
9
10
11
12
13
14
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
General
Pulse width modulation frequency
Protections
Over-temperature
Short-circuit across the loudspeaker terminals
and to supply lines
Start-up safety test
Supply voltage alarm
Differential audio inputs
LIMITING VALUES
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
STATIC CHARACTERISTICS
SWITCHING CHARACTERISTICS
DYNAMIC AC CHARACTERISTICS (STEREO
AND DUAL SE APPLICATION)
15
16
16.1
16.2
16.3
16.4
16.5
16.6
16.7
16.8
16.9
16.10
16.11
16.12
17
18
18.1
18.2
18.3
18.4
18.5
19
20
21
DYNAMIC AC CHARACTERISTICS (MONO
BTL APPLICATION)
APPLICATION INFORMATION
BTL application
Pin MODE
Output power estimation
External clock
Heatsink requirements
Output current limiting
Pumping effects
Reference design
PCB information for HSOP24 encapsulation
Classification
Reference design: bill of materials
Curves measured in the reference design
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2003 Jul 28
2