PDIUSBD12 Datasheet, PDF (30/35 Pages) NXP Semiconductors – USB interface device with parallel bus

Philips Semiconductors
PDIUSBD12
USB interface device with parallel bus
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
D
y
Z
28
pin 1 index
1
e
E
A
X
c
H_E
vM A
15
14
wM
b_p
A₂
A₁
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽²⁾ e
H_E
mm
1.10
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT361-1
MO-153
L
L_p
Q
1.0
0.75
0.50
0.4
0.3
v
w
y
0.2 0.13 0.1
Z ⁽¹⁾
θ
0.8
8^o
0.5
0^o
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
99-12-27
Fig 24. TSSOP28 package outline.
9397 750 09238
Product data
Rev. 08 — 20 December 2001
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
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