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TDA8003TS Datasheet, PDF (3/24 Pages) NXP Semiconductors – I2C-bus SIM card interface
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Philips Semiconductors
I2C-bus SIM card interface
Product specification
TDA8003TS
QUICK REFERENCE DATA
SYMBOL
VDD
IDD
VDDI
VCC
SR
tde
tact
fi(SIMCLK)
Tamb
PARAMETER
supply voltage on pins VDDS
and VDDP
supply current on pins VDDS
and VDDP
interface signal supply voltage
card supply voltage
slew rate on VCC (rise and fall)
deactivation time
activation time
clock input frequency
operating ambient temperature
CONDITIONS
MIN.
2.5
Off mode; VDD = 3 V
−
Power-down mode; VDD = 3 V;
−
VCC = 5 V; ICC = 100 µA; SIMCLK
connected to PGND or VDDI;
CLK is stopped
active mode; VDD = 3 V; VCC = 3 V; −
ICC = 6 mA; fCLK = 3.25 MHz
active mode; VDD = 3 V; VCC = 5 V; −
ICC = 10 mA; fCLK = 3.25 MHz
active mode; VDD = 5 V; VCC = 3 V; −
ICC = 6 mA; fCLK = 3.25 MHz
active mode; VDD = 5 V; VCC = 5 V; −
ICC = 10 mA; fCLK = 3.25 MHz
1.5
5 V card; active mode;
4.6
0 < ICC < 15 mA; 40 nAs dynamic
load on 200 nF capacitor
3 V card; active mode;
2.75
0 < ICC < 10 mA; 24 nAs dynamic
load on 200 nF capacitor
5 V card; bit PDOWN = 1; ICC < 5 mA 4.6
3 V card; bit PDOWN = 1; ICC < 5 mA 2.75
CL(max) = 200 nF
0.05
−
−
0
−40
TYP.
−
−
−
−
−
−
−
−
5
3
−
−
−
−
−
−
−
MAX. UNIT
6
V
2
µA
500 µA
18 mA
50 mA
10 mA
30 mA
6
V
5.4 V
3.25 V
5.4 V
3.25 V
0.25 V/µs
120 µs
150 µs
20 MHz
+85 °C
2000 Apr 20
3
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