TDA8003TS Datasheet, PDF (12/24 Pages) NXP Semiconductors – I2C-bus SIM card interface

Philips Semiconductors
I²C-bus SIM card interface
Product specification
TDA8003TS
Protections
The following main hardware fault conditions are
monitored by the circuit:
• Short circuits between V_CC and other contacts
• Card take-off during transaction
• Supply drop-out.
When one of these problems is detected during a card
session, the security logic block pulls SIMERR to LOW, to
warn the microcontroller and initiates an automatic
deactivation of the contacts (see Fig.6).
I/O circuit
The Idle state is realized by both I/O and SIMI/O being
pulled HIGH (via a 10 kΩ pull-up resistor from I/O to V_CC
and via a 20 kΩ pull-up resistor from SIMI/O to V_DDI).
I/O is referenced to V_CC and SIMI/O to V_DDI, thus allowing
operation with V_CC ≠ V_DD ≠ V_DDI.
When configuration bit I/OEN is logic 0, then I/O and
SIMI/O are independent, which allows parallelization of
several TDA8003TS with only one I/O line on the
microcontroller side (up to 4 different I²C-bus addresses).
When bit I/OEN is logic 1, then the data transmission
between I/O and SIMI/O is enabled.
The first side on which a falling edge occurs becomes the
master. An anti-latch circuit disables the detection of falling
edges on the other side, which becomes a slave.
After a delay time t_d (<500 ns) on the falling edge, the
N transistor on the slave side is turned on, thus
transmitting the logic 0 present on the master side.
When the master goes back to logic 1, the P transistor on
the slave side is turned on during t_d, and then both sides
return to their Idle states.
The maximum frequency on these lines is 1 MHz.
handbook, full pagewidth
START
SIMERR
RST
CLK
I/O
VCC
2000 Apr 20
status readout
Fig.6 Emergency deactivation.
12
MGR439