BUK763R4-30B_15 Datasheet, PDF (3/14 Pages) NXP Semiconductors – N-channel TrenchMOS standard level FET

NXP Semiconductors
BUK763R4-30B
N-channel TrenchMOS standard level FET
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
V_DS
V_DGR
V_GS
I_D
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
T_j ≥ 25 °C; T_j ≤ 175 °C
R_GS = 20 kΩ
T_mb = 25 °C; V_GS = 10 V;
see Figure 1; see Figure 4
T_mb = 100 °C; V_GS = 10 V; see Figure 1
T_mb = 25 °C; V_GS = 10 V; see Figure 1;
see Figure 4
I_DM
peak drain current
T_mb = 25 °C; pulsed; t_p ≤ 10 µs;
see Figure 4
P_tot
total power dissipation
T_stg
storage temperature
T_j
junction temperature
Source-drain diode
T_mb = 25 °C; see Figure 2
I_S
source current
T_mb = 25 °C
I_SM
peak source current
Avalanche ruggedness
E_DS(AL)S
non-repetitive drain-source
avalanche energy
E_DS(AL)R
repetitive drain-source
avalanche energy
pulsed; t_p ≤ 10 µs; T_mb = 25 °C
I_D = 75 A; V_sup ≤ 30 V; R_GS = 50 Ω;
V_GS = 10 V; T_j(init) = 25 °C; unclamped
see Figure 3
Min
-
-
-20
[1] _-
[1] _-
[2][3] _-
-
-
-55
-55
[2][3] _-
[1] _-
-
-
[4][5][6][ _-
7]
[1] Continuous current is limited by package.
[2] Current is limited by power dissipation chip rating.
[3] Refer to document 9397 750 12572 for further information.
[4] Maximum value not quoted. Repetitive rating defined in avalanche rating figure.
[5] Single-shot avalanche rating limited by maximum junction temperature of 175 °C.
[6] Repetitive avalanche rating limited by an average junction temperature of 170 °C.
[7] Refer to application note AN10273 for further information.
Max Unit
30 V
30 V
20 V
75 A
75 A
198 A
794 A
255 W
175 °C
175 °C
198 A
75 A
794 A
1.3 J
-
J
BUK763R4-30B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 April 2011
© NXP B.V. 2011. All rights reserved.
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