TDA8024 Datasheet, PDF (25/29 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
Product specification
TDA8024
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
D
y
Z
28
pin 1 index
1
e
E
A
X
c
H_E
vM A
15
14
wM
b_p
A₂
A₁
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽²⁾ e
H_E
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT361-1
MO-153
L
L_p
Q
v
w
y
Z ⁽¹⁾
θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.8
0.5
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
2004 July 12
25