TDA8024 Datasheet, PDF (23/29 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
Product specification
TDA8024
handbook, full pagewidth
+5 V
100 nF
10 µF
100 nF⁽¹⁾
100 nF⁽¹⁾
100 kΩ
+3.3 V
CLKDIV1 ₁
CLKDIV2 ₂
5V/3V ₃
PGND ₄
S2 ₅
VDDP ₆
S1 ₇
VUP _{8 TDA8024}
PRES ₉
PRES ₁₀
I/O ₁₁
AUX2 ₁₂
AUX1 ₁₃
CGND ₁₄
(3)
28 ^AUX2UC
27 ^AUX1UC
26 ^I/OUC
25 ^XTAL2
24 ^XTAL1
23 ^OFF
22 ^GND
21 ^VDD
20 ^RSTIN
19 ^CMDVCC
18 ^PORADJ
17 ^VCC
16 ^RST
15 ^CLK
100 nF⁽⁴⁾
33 pF
3.3 V POWERED
MICROCONTROLLER
100 nF
+3.3 V⁽²⁾
+3.3 V
VDD
58.1 kΩ
(7)
CARD READ
(normally closed type)
220 nF⁽⁵⁾
C5 C1
C6 C2
C7 C3 ⁽⁶⁾
C8 C4
K1
K2
MDB050
41.9 kΩ
(1) These capacitors must be of the low ESR-type and be placed near the IC (within 100 mm).
(2) TDA8024 and the microcontroller must use the same V_DD supply.
(3) Make short, straight connections between CGND, C5 and the ground connection to the capacitor.
(4) Mount one low ESR-type 100 nF capacitor close to pin V_CC.
(5) Mount one low ESR-type 100 or 220 nF capacitor close to C1 contact (less than 100 mm from it).
(6) The connection to C3 should be routed as far from C2, C7, C4 and C8 and, if possible, surrounded by grounded tracks.
(7) Optional resistor bridge for changing the threshold of V_DD. If this bridge is not required pin 18 should be connected to ground; see Section 8.2.2.
Pin 18 is not connected in the TDA8024AT.
Fig.13 Application diagram.
2004 July 12
23