TDA8024 Datasheet, PDF (19/29 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
Product specification
TDA8024
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP
MAX. UNIT
Crystal oscillator (pins XTAL1 and XTAL2)
C_XTAL1,
external capacitance on depends on type of crystal or −
−
C_XTAL2
pins XTAL1 and XTAL2 resonator used
f_XTAL
crystal frequency
2
−
f_XTAL1
frequency applied on
pin XTAL1
0
−
V_IL
LOW-level input voltage on
pin XTAL1
−0.3
−
V_IH
HIGH-level input voltage
on pin XTAL1
0.7V_DD
−
15
pF
26
MHz
26
MHz
+0.3V_DD V
V_DD + 0.3 V
Data lines (pins I/O, I/OUC, AUX1, AUX2, AUX1UC and AUX2UC)
t_{d(I/O-I/OUC),} I/O to I/OUC, I/OUC to I/O
−
t_d(I/OUC-I/O) falling edge delay
t_pu
active pull-up pulse width
−
f_I/O(max)
maximum frequency on
−
data lines
C_i
input capacitance on data
−
lines
−
200
ns
−
100
ns
−
1
MHz
−
10
pF
Data lines to card reader (pins I/O, AUX1 and AUX2; with integrated 11 kΩ pull-up resistors to V_CC)
V_o(inactive)
output voltage
inactive mode
no load
0
−
0.1
V
I_o(inactive)
V_OL
V_OH
V_IL
V_IH
I_IL
I_LIH
I_o(inactive) = 1 mA
−
−
output current
inactive mode; pin grounded −
−
LOW-level output voltage I_OL = 1 mA
0
−
I_OL ≥ 15 mA
V_CC − 0.4 −
HIGH-level output voltage no DC load
0.9V_CC
−
5 and 3 V cards; I_OH < −40 µA 0.75V_CC −
I_OH ≥ 10 mA
0
−
LOW-level input voltage
0.3
−
HIGH-level input voltage
1.5
−
LOW-level input current V_IL = 0 V
−
−
HIGH-level input leakage V_IH = V_CC
current
−
−
0.3
V
−1
mA
0.3
V
V_CC
V
V_CC + 0.1 V
V_CC + 0.1 V
0.4
V
0.8
V
V_CC + 0.3 V
600
µA
10
µA
t_t(DI)
t_t(DO)
data input transition time V_IL(max) to V_IH(min)
−
data output transition time V_o = 0 to V_CC; C_L ≤ 80 pF;
−
10% to 90%
−
1.2
µs
−
0.1
µs
R_pu
integrated pull-up resistor pull-up resistor to V_CC
9
11
13
kΩ
I_pu
current when pull-up active V_OH = 0.9V_CC; C = 80 pF
−1
−
−
mA
2004 July 12
19