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TDA8024 Datasheet, PDF (21/29 Pages) NXP Semiconductors – IC card interface | |||
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Philips Semiconductors
IC card interface
Product speciï¬cation
TDA8024
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP
tf
fall time
CL = 30 pF; note 5
â
â
δ
duty factor (except for
CL = 30 pF; note 5
fXTAL)
45
â
SR
slew rate
slew up or down; CL = 30 pF 0.2
â
Control inputs (pins CLKDIV1, CLKDIV2, CMDVCC, RSTIN and 5V/3V); note 6
VIL
VIH
ILIL
ILIH
LOW-level input voltage
HIGH-level input voltage
LOW-level input leakage
current
HIGH-level input leakage
current
0 < VIL < VDD
0 < VIH < VDD
â0.3
â
0.7VDD
â
â
â
â
â
Card presence inputs (pins PRES and PRES); note 7
VIL
VIH
ILIL
ILIH
LOW-level input voltage
HIGH-level input voltage
LOW-level input leakage
current
HIGH-level input leakage
current
0 < VIL < VDD
0 < VIH < VDD
â0.3
â
0.7VDD
â
â
â
â
â
Interrupt output (pin OFF; NMOS drain with integrated 20 k⦠pull-up resistor to VDD)
VOL
LOW-level output voltage IOL = 2 mA
0
â
VOH
HIGH-level output voltage IOH = â15 µA
0.75VDD â
Rpu
integrated pull-up resistor 20 k⦠pull-up resistor to VDD 16
20
Protection and limitation
ICC(sd)
II/O(lim)
shutdown and limitation
current pin VCC
limitation current pins I/O,
AUX1 and AUX2
â
130
â15
â
ICLK(lim)
IRST(lim)
Tsd
limitation current pin CLK
limitation current pin RST
shut-down temperature
â70
â
â20
â
â
150
Timing
tact
activation time
see Fig.7
tde
deactivation time
see Fig.8
t3
start of the window for
see Fig.7
sending CLK to the card
50
â
50
80
50
â
t5
end of the window for
see Fig.7
sending CLK to the card
140
â
tdebounce
debounce time pins PRES see Fig.10
and PRES
5
8
MAX.
16
55
UNIT
ns
%
â
V/ns
+0.3VDD V
VDD + 0.3 V
1
µA
1
µA
+0.3VDD V
VDD + 0.3 V
5
µA
5
µA
0.3
V
â
V
24
kâ¦
150
mA
+15
mA
+70
mA
+20
mA
â
°C
220
µs
100
µs
130
µs
220
µs
11
ms
2004 July 12
21
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