TDA8001 Datasheet, PDF (20/24 Pages) NXP Semiconductors – Smart card interface

Philips Semiconductors
Smart card interface
PACKAGE OUTLINES
DhaInPdb2o8ok:, fpulllapasgetwicidthdual in-line package; 28 leads (600 mil)
Product specification
TDA8001
SOT117-1
D
L
Z
e
28
pin 1 index
M_E
A_{2 A}
A₁
wM
b₁
b
15
c
(e ₁)
M_H
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
5.1 0.51 4.0
1.7
1.3
0.53 0.32
0.38 0.23
36.0
35.0
14.1
13.7
2.54 15.24
3.9
3.4
15.80 17.15
15.24 15.90
0.25
1.7
inches
0.20
0.020
0.16
0.066 0.020 0.013
0.051 0.014 0.009
1.41
1.34
0.56
0.54
0.10
0.60
0.15
0.13
0.62
0.60
0.68
0.63
0.01 0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT117-1
IEC
051G05
REFERENCES
JEDEC
EIAJ
MO-015AH
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
1996 Dec 12
20