TDA8001 Datasheet, PDF (12/24 Pages) NXP Semiconductors – Smart card interface

Philips Semiconductors
Smart card interface
Product specification
TDA8001
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
V_DD
supply voltage
−0.3
V_x1
voltage on pins VPP21, VPP15, VPP12.5, PRES,
0
PRES, CMDVCC, OFF, ALARM, DETECT and RSTIN
V_H
voltage on pin V_H
0
V_PP
voltage on pin V_PP
0
V_SUP
voltage on pin V_SUP
0
V_x2
voltage on pins ALARM and DELAY
0
V_x3
voltage on pins XTAL, I/O(µC), CLKOUT2, CMD7,
0
CMD3.5 and CVNC
V_x4
voltage on pins I/O, RST, CLK and V_CC
P_tot
continuous total power dissipation
duration < 1 ms
0
TDA8001;
−
T_amb = +70 °C; note 1;
see Fig.10
TDA8001T;
−
T_amb = +70 °C; note 1;
see Fig.11
T_stg
storage temperature
−55
V_es
electrostatic voltage on pins I/O, V_CC, V_PP, RST, CLK,
−6
PRES and PRES
electrostatic voltage on other pins
−2
MAX. UNIT
18
V
V_DD
V
30
V
V_H
V
12
V
V_SUP V
6.0 V
7.0 V
2
W
0.92 W
+150 °C
+6
kV
+2
kV
Note
1. P_tot = V_DD × (I_DD(unloaded) + ∑I_signals) + I_CC × (V_DD − V_CC) + max.{(V_H − V_PP) × I_PP(read) + (V_H − V_PP) × I_PP(write)}
+ V_H × I_H(unloaded) + V_SUP × I_SUP + (V_DD − CVNC) × I_CVNC, where ‘signals’ means all signal pins, except supply pins.
1996 Dec 12
12