TDA8001 Datasheet, PDF (16/24 Pages) NXP Semiconductors – Smart card interface

Philips Semiconductors
Smart card interface
Product specification
TDA8001
SYMBOL
PARAMETER
CONDITIONS
MIN.
Card supply voltage (V_CC)
V_CC
output voltage
I_CC
output current
SR
slew rate
idle mode; active mode
I_CC < 100 mA
∆I_PP/∆t < 100 mA/100 ns;
note 4
V_CC from 0 to 5 V
V_CC shorted to GND
up or down
−
4.75
4.75
−
−
0.3
5 V reference output voltage (CVNC)
V_CVNC
output voltage at pin CVNC
4.5
I_CVNC
output current at pin CVNC
−
Crystal connection (XTAL)
R_xtal(neg) negative resistance at pin XTAL 2 MHz < f_i < 16 MHz;
−
note 5
V_xtal
DC voltage at pin XTAL
3.0
f_xtal
resonant frequency
4
external frequency
0
Clock output (CLKOUT2)
f_CLKOUT2
V_OL
V_OH
frequency on CLKOUT2
LOW level output voltage
HIGH level output voltage
t_r, t_f
rise and fall times
δ
duty factor
1
I_OL = 2 mA
−
I_OH = −200 µA
3.0
I_OH = −10 µA
4.0
C_L = 15 pF; note 2
−
C_L = 15 pF; note 2
40
Data line [I/O, I/O(µC)]
V_OH
HIGH level output voltage on
4.5 V < V_SUP < 5.5 V;
4.0
pin I/O
4.5 V < V_I/O(µC) < 5.5 V;
I_OH = −20 µA
4.5 V < V_SUP < 5.5 V;
2.4
4.5 V < V_I/O(µC) < 5.5 V;
I_OH = −200 µA
V_OL
LOW level output voltage on
I_I/O = 1 mA;
−
pin I/O
I/O(µC) grounded
I_IL
LOW level input current on
I/O(µC) grounded
−
pin I/O(µC)
V_OH
HIGH level output voltage on
4.5 V < V_I/O < 5.5 V
4.0
pin I/O(µC)
V_OL
LOW level output voltage on
I_I/O(µC) = 1 mA;
−
pin I/O(µC)
I/O grounded
I_IL
LOW level input current on pin I/O I/O grounded
−
TYP.
MAX. UNIT
−
0.4
−
5.25
−
5.25
−
−100
−
−200
0.4
0.5
V
V
V
mA
mA
V/µs
5.0
5.5
V
−
−50
mA
−
300
−
4.0
−
16
−
20
Ω
V
MHz
MHz
−
8
−
0.4
−
−
−
−
−
25
−
60
MHz
V
V
V
ns
%
−
V_CC + 0.1 V
−
−
V
−
100
mV
−
−500
µA
−
V_SUP + 0.2 V
−
70
mV
−
−500
µA
1996 Dec 12
16