TDA8001 Datasheet, PDF (13/24 Pages) NXP Semiconductors – Smart card interface

Philips Semiconductors
Smart card interface
Product specification
TDA8001
4
handbook, halfpage
P _tot
(W)
3
2
1
MBE256
handbook, h³alfpage
P _tot
(W)
2
1
MBE255
0
50
0
50
100
150
Tamb (^oC)
0
50
0
50
100
150
Tamb (^oC)
Fig.10 Power derating curve (DIP28).
Fig.11 Power derating curve (SO28).
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500 Ω, 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground.
THERMAL CHARACTERISTICS
SYMBOL
R_{th j-a}
PARAMETER
thermal resistance from junction to ambient in free air
SOT117-1
SOT136-1
VALUE
30
70
UNIT
K/W
K/W
1996 Dec 12
13