TDA8260TW Datasheet, PDF (18/23 Pages) NXP Semiconductors – Satellite Zero-IF QPSK/8PSK downconverter with PLL synthesizer

Philips Semiconductors
Satellite Zero-IF QPSK/8PSK
downconverter with PLL synthesizer
PACKAGE OUTLINE
HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
Product specification
TDA8260TW
SOT633-3
D
c
y
exposed die pad side
Z
Dh
38
20
E
A
X
HE
vM A
Eh
1
pin 1 index
e
A2
A1
19
bp
wM
(A3)
A
θ
Lp
L
detail X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D⁽¹⁾ Dh E⁽²⁾ Eh
e
HE
mm
1.2
0.15
0.05
1.05
0.80
0.25
0.30
0.19
0.20
0.09
12.6
12.4
3.65
3.45
6.2
6.0
2.85
2.65
0.65
8.3
7.9
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT633-3
---
REFERENCES
JEDEC
JEITA
---
---
L
Lp
v
w
y
Z
θ
1
0.75
0.45
0.2
0.1
0.1
0.6
0.2
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
04-01-22
2004 Sep 03
18