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| TDA8358J Datasheet, PDF (17/20 Pages) NXP Semiconductors – Full bridge vertical deflection output circuit in LVDMOS with east-west amplifier | |||
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Philips Semiconductors
Full bridge vertical deï¬ection output circuit
in LVDMOS with east-west ampliï¬er
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
Product speciï¬cation
TDA8358J
SOT141-6
non-concave
x
Dh
D
Eh
view B: mounting base side
d
A2
B
j
E
A
L3
1
13
Z
e1
wM
bp
e
L
Q
c
vM
m
e2
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A2 bp c D(1) d Dh E(1) e e 1 e 2 Eh
j
L L3 m Q
v
w
x Z (1)
mm
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.4 0.60 0.38 23.6 19.6
10
12.2
11.8
3.4
1.7 5.08
6
3.4 12.4 2.4
3.1 11.0 1.6
4.3
2.1
1.8
0.8
0.25
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT141-6
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-12-16
99-12-17
1999 Dec 22
17
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