TDA8004AT Datasheet, PDF (17/22 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
APPLICATION DIAGRAM
More application
information
on application report
AN97036
+5 V
100 10
nF
µF
100
nF
These capacitors
must be placed
near the IC and
100
have low ESR
nF
(less than 1 cm).
100 kΩ
+3.3 V
Straight and short
connections between
CGND, C5 and
capacitors GND
(no loop).
2004 May 10
Product specification
TDA8004AT
V_DD for the TDA8004 must be the same as controller
supply voltage, CLKDIV1, CLKDIV2, RSTIN, PRES,
PRES, AUXUC, I/OUC, AUX2UC, RFU1, CMDVCC,
OFF should be referenced to V_DD and also XTAL1
if driven by external clock.
CLKDIV1
1
AUX2UC
28
CLKDIV2
2
AUX1UC
27
5V/3V
3
I/OUC
26
GNDP
4
XTAL2
26
S2
5
XTAL1
24
V_DDP
6
OFF
23
S1
GND
7
22
VUP
TDA8004AT
V_DD
8
21
PRES
9
RSTIN
20
PRES
10
CMDVCC
19
I/O
11
n.c.
18
AUX2
12
17 ^VCC
AUX1
13
RST
16
CGND
14
CLK
15
100 nF
CARD READ
(NORMALLY
CLOSED TYPE)
200 nF
C5
C1
C6
C2
C7
C3
C8
C4
K1
K2
fce667
33 pF
3.3 V POWERED
MICROCONTROLLER
100 nF
+3.3 V
+3.3 V
One 100 nF
with low ESR
near pin 17.
One 100 nF or 220 nF
with low ESR
near C1 contact
(less than 1 cm).
C3 should be routed
far from C2, C7, C4 and C8
and, better, surrounded
with ground tracks.
Fig.10 Application diagram.
17