TDA8004AT Datasheet, PDF (12/22 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
Product specification
TDA8004AT
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
SYMBOL
PARAMETER
V_DD, V_DDP
V_n1
supply voltage
voltage on pins XTAL1, XTAL2, 5V/3V, RSTIN,
AUX2UC, AUX1UC, I/OUC, CLKDIV1, CLKDIV2,
CMDVCC and OFF
V_n2
voltage on card contact pins PRES, PRES, I/O, RST,
AUX1, AUX2 and CLK
V_n3
voltage on pins VUP, S1 and S2
T_stg
IC storage temperature
P_tot
continuous total power dissipation
T_j
junction temperature
V_es1
electrostatic voltage on pins I/O, RST, V_CC, AUX1,
CLK, AUX2, PRES and PRES
V_es2
electrostatic voltage on all other pins
CONDITIONS
MIN.
−0.3
−0.3
MAX. UNIT
+7
V
+7
V
−0.3 +7
V
−
−55
T_amb = −25 to +85 °C −
−
−6
+9
V
+125 °C
0.56 W
150 °C
+6
kV
−2
+2
kV
Note
1. All card contacts are protected against any short with any other card contact.
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM; 1500 Ω; 100 pF) 3 pulses positive and 3 pulses negative on each pin referenced to ground.
THERMAL RESISTANCE
SYMBOL
PARAMETER
R_th(j-a)
thermal resistance from junction to ambient
CONDITIONS
in free air
VALUE
70
UNIT
K/W
2004 May 10
12