TDA8941P Datasheet, PDF (16/21 Pages) NXP Semiconductors – 1.5 W mono Bridge Tied Load BTL audio amplifier

Philips Semiconductors
16. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
TDA8941P
1.5 W mono BTL audio amplifier
SOT97-1
D
L
Z
e
b
8
A_{2 A}
A₁
wM
b₁
b₂
5
pin 1 index
E
M_E
c
(e ₁)
M_H
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
b₂
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
4.2
0.51
3.2
1.73 0.53
1.14 0.38
1.07 0.36
0.89 0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches _0.17
0.020
0.13
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT97-1
IEC
050G01
REFERENCES
JEDEC
EIAJ
MO-001
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
99-12-27
Fig 15. DIP8 package outline.
9397 750 06864
Product specification
Rev. 02 — 7 April 2000
© Philips Electronics N.V. 2000. All rights reserved.
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