TDA8941P Datasheet, PDF (14/21 Pages) NXP Semiconductors – 1.5 W mono Bridge Tied Load BTL audio amplifier

Philips Semiconductors
idth
TDA8941P
1.5 W mono BTL audio amplifier
54 mm
56 mm
OUT+
ON
OUT− _{+ −}
10 µF
MUTE
1
IN−
220 nF
IN+
1.5 nF
100 nF
VCC
1000 µF _GND
MGU017
Fig 14. Printed-circuit board layout (single-sided); components view.
14.1.2 Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor locations should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR – typical 100 nF – has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor – e.g. 1000 µF or greater – must be placed close to the device.
9397 750 06864
Product specification
The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
Rev. 02 — 7 April 2000
© Philips Electronics N.V. 2000. All rights reserved.
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