TDA8000 Datasheet, PDF (14/24 Pages) NXP Semiconductors – Smart card interface

Philips Semiconductors
Smart card interface
Product specification
TDA8000; TDA8000T
SYMBOL
PARAMETER
Card supply voltage (V_CC)
V_CC
output voltage
I_CC
output current
SR
slew rate
5 V reference output (CVNC)
V_CVNC
output voltage at CVNC
Crystal connection (XTAL)
R_xtal(neg) negative resistance at crystal
V_xtal
DC voltage at crystal
f_xtal
crystal resonant frequency
External clock input (CLKIN)
f_ext
frequency at CLKIN
V_IL
LOW level input voltage
V_IH
HIGH level input voltage
I_IL
LOW level input current
I_IH
HIGH level input current
C_I
input capacitance
Clock output (CLKOUT)
f_CLKOUT
V_OL
V_OH
frequency on CLKOUT
LOW level output voltage
HIGH level output voltage
t_r, t_f
rise and fall times
δ
duty factor
∆δ/∆θ
thermal drift on duty factor
CONDITIONS
MIN.
TYP.
MAX. UNIT
idle mode
active mode;
I_CC < 100 mA
V_CC connected to GND
up or down
−
4.80
−
−
0.80
I_CVNC < −15 mA
4.5
3 MHz < f_i < 11 MHz;
−
note 4
3
3
note 2
0
0
1.5
V_IL = 0 V
−
V_IH = 2 V
−
−
1
I_OL = 1 mA
−
V_OH = −200 µA
3
V_OH = −10 µA
4
C_L = 30 pF; note 2
−
CLKDIV = 0;
45
C_L = 30 pF; note 2
CLKDIV = 1;
40
C_L = 30 pF; note 2
DIP and SO packages −
−
0.4
−
5.20
−
−100
−
−400
1.0
1.20
5.0
5.5
−
−300
−
4
−
11
−
8
−
0.8
−
5
−
−20
−
20
−
5
−
8
−
0.4
−
−
−
−
−
25
−
55
−
60
−0.1 −
V
V
mA
mA
V/µs
V
Ω
V
MHz
MHz
V
V
µA
µA
pF
MHz
V
V
V
ns
%
%
%/C
1996 Dec 12
14