74HC_HCT259_15 Datasheet, PDF (14/22 Pages) NXP Semiconductors – 8-bit addressable latch

NXP Semiconductors
12. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
74HC259; 74HCT259
8-bit addressable latch
SOT38-4
D
L
Z
e
b
16
pin 1 index
A_{2 A}
A₁
wM
b₁
b₂
9
M_E
c
(e ₁)
M_H
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
b₂
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36 19.50 6.48
0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches _0.17
0.02
0.13
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT38-4
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-01-14
03-02-13
Fig 13. Package outline SOT38-4 (DIP16)
74HC_HCT259
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 7 August 2012
© NXP B.V. 2012. All rights reserved.
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