BUK215-50YT Datasheet, PDF (12/13 Pages) NXP Semiconductors – TOPFET high side switch SMD version

Philips Semiconductors
TOPFET high side switch
SMD version
MECHANICAL DATA
Plastic single-ended surface mounted package (Philips version of D²-PAK); 5 leads
(one lead cropped)
Product Specification
BUK215-50YT
SOT426
E
D1
D
HD
3
1
24
5
b
eeee
A
A1
mounting
base
Lp
c
Q
0
2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
c
D
max.
D1
mm ^{4.50 1.40 0.85 0.64}
4.10 1.27 0.60 0.46
11
1.60
1.20
E
e
10.30 _1.70
9.70
Lp
HD
Q
2.90 15.80 2.60
2.10 14.80 2.20
OUTLINE
VERSION
IEC
SOT426
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
98-12-14
99-06-25
Fig.33. SOT426 surface mounting package¹, centre pin connected to mounting base.
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
June 2000
12
Rev 1.000