PSMN3R0-30YLD_15 Datasheet, PDF (10/13 Pages) NXP Semiconductors – N-channel 30 V, 3.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology

NXP Semiconductors
PSMN3R0-30YLD
N-channel 30 V, 3.0 mΩ logic level MOSFET in LFPAK56 using
NextPowerS3 Technology
11. Package outline
Plastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leads
SOT669
L₁
HD
E
A
A₂
C
b₂
c₂
E₁
mounting
base
b₃
b₄
D₁
L₂
1
2
3
4
e
b
wA
1/2 e
X
c
A
A₁ ^C
detail X
(A₃)
q
L
yC
0
5 mm
θ
scale
8^°
0^°
Dimensions (mm are the original dimensions)
Unit⁽¹⁾
A A₁ A₂ A₃ b b₂ b₃ b₄
c
c₂ D⁽¹⁾ D₁₍₁₎ E⁽¹⁾ E₁₍₁₎ e
H
L L₁
max 1.20 0.15 1.10
0.50 4.41 2.2
mm nom
0.25
min 1.01 0.00 0.95
0.35 3.62 2.0
0.9 0.25 0.30 4.10 4.20 5.0
0.7 0.19 0.24 3.80
4.8
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
3.3
6.2 0.85 1.3
1.27
3.1
5.8 0.40 0.8
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT669
MO-235
L₂ w y
1.3
0.25 0.1
0.8
sot669_po
Issue date
11-03-25
13-02-27
Fig. 17. Package outline LFPAK56; Power-SO8 (SOT669)
PSMN3R0-30YLD
Product data sheet
All information provided in this document is subject to legal disclaimers.
18 February 2014
© NXP N.V. 2014. All rights reserved
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