AR0237CS Datasheet, PDF (7/38 Pages) ON Semiconductor – 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor

AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
high dynamic range mode of operation where two images and taken using different
exposures. These images are output in from the sensor and the ISP must combine them
into one high dynamic range image.
Figure 2: Typical Configuration: Serial Four-Lane HiSPi Interface
Digital Digital
I/O Core
power¹ power¹
HiSPi
PLL Analog Analog
power¹ power¹ power¹ power¹
Master clock
(6–48 MHz)
From
controller
VDD_IO VDD
EXTCLK
SADDR
SDATA
SCLK
TRIGGER
OE_BAR
RESET_BAR
TEST
DGND
VDD_PLL VAA VAA_PIX
SLVS0_P
SLVS0_N
SLVS1_P
SLVS1_N
SLVS2_P
SLVS2_N
SLVS3_P
SLVS3_N
SLVSC_P
SLVSC_N
FLASH
SHUTTER
AGND
VDD_IO
VDD
VDD_SLVS VDD_PLL
VAA
VAA_PIX
Digital
ground
Analog
ground
To
controller
Notes:
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for
slower two-wire speed.
3. The parallel interface output pads can be left unconnected if the serial output interface is used.
4. ON Semiconductor recommends that 0.1F and 10F decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on lay-
out and design considerations. Refer to the AR0237 demo headboard schematics for circuit recom-
mendations.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that cou-
pling with the digital power planes is minimized.
6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
AR0237CS/D Rev. 4, 6/16 EN
7
©Semiconductor Components Industries, LLC, 2016.