74HC00 Datasheet, PDF (6/7 Pages) NXP Semiconductors – Quad 2-input NAND gate

74HC00
PACKAGE DIMENSIONS
0.15 (0.006) T U S
2X L/2 ¹⁴
L
PIN 1
IDENT.
1
TSSOP-14
CASE 948G-01
ISSUE B
14X K REF
0.10 (0.004) M T U S V S
N
0.25 (0.010)
8
M
B
-U- N
F
7
DETAIL E
0.15 (0.006) T U S
A
-V-
K
J J1 ÇÇÉÉÇÇÉÉK1ÇÇÉÉ
SECTION N-N
C
0.10 (0.004)
-T- SEATING
PLANE
D
G
H
DETAIL E
NOTES:
ąă1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
ąă2. CONTROLLING DIMENSION: MILLIMETER.
ąă3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
ąă4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
ąă5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
ąă6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
ąă7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE -W-.
-W-
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC
0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6