74HC00 Datasheet, PDF (2/7 Pages) NXP Semiconductors – Quad 2-input NAND gate

74HC00
ÎÎMÎÎ_SA_ymXÎÎI_bM_olUÎÎM RÎÎATÎÎINGÎÎS ÎÎÎÎ_ParaÎÎ_meÎÎ_ter ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ_ValuÎÎ_e ÎÎÎÎ_UÎÎ_nitÎÎ
V_CC DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V_in DC Input Voltage (Referenced to GND)
– 0.5 to V_CC + 0.5
V
V_out DC Output Voltage (Referenced to GND)
– 0.5 to V_CC + 0.5
V
I_in
DC Input Current, per Pin
±20
mA
I_out DC Output Current, per Pin
±25
mA
I_CC DC Supply Current, V_CC and GND Pins
±50
mA
P_D Power Dissipation in Still Air, SOIC Package†
500
mW
TSSOP Package†
450
T_stg Storage Temperature
– 65 to + 150
_C
ąThis device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high-impedance
circuit. For proper operation, V_in and
V_out should be constrained to the
range GND v (V_in or V_out) v V_CC.
ąUnused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V_CC).
Unused outputs must be left open.
T_L
Lead Temperature, 1 mm from Case for 10 s
_C
SOIC or TSSOP Package
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: - 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High- Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V_CC
V_in, V_out
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage
(Referenced to GND)
2.0
6.0
V
0
V_CC
V
T_A
Operating Temperature, All Package Types
– 55 + 125
_C
t_r, t_f
Input Rise and Fall Time
ą(Figure 1)
V_CC = 2.0 V
0
V_CC = 4.5 V
0
V_CC = 6.0 V
0
1000
ns
500
400
ORDERING INFORMATION
Device
Package
Shipping^†
74HC00DR2G
74HC00DTR2G
SOIC-14
(Pb-Free)
TSSOP-14*
2500/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb-Free.
http://onsemi.com
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