LC823450 Datasheet, PDF (54/55 Pages) ON Semiconductor – Low Power & High-Resolution Audio Processing System LSI

LC823450
PACKAGE DIMENSIONS
unit : mm
[LC823450XATBG, LC823450XBTBG, LC823450XCTBG, LC823450XDTBG]
* The diameter of footprint of the solder ball is as follows.
XA, XB
XC, XD
Package Code
Size of the footprint
 0.20
 0.22
WLCSP154, 5.52x5.33
CASE 567LD
ISSUE A
E
PIN A1
REFERENCE
2X
0.03 C
2X
0.03 C
0.10 C
0.05 C
NOTE 3 _A1
TOP VIEW
DETAIL A
SIDE VIEW
AB
D
A
C
SEATING
PLANE
BACK
COAT
A3
A
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF THE SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A
0.73
A1 0.18 0.24
A3
0.04 REF
b 0.23 0.29
D
5.52 BSC
E
5.33 BSC
e
0.40 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
A1
OUTLINE
e
e/2
N
M
KL
J
H
G
F
E
DC
B
A
1 3 5 7 9 11
2 4 6 8 10 12
BOTTOM VIEW
e
154X b
0.05 C A B
0.03 C
0.40
PITCH
0.40
PITCH
154X
0.22
0.20
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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