LC823450 Datasheet, PDF (22/55 Pages) ON Semiconductor – Low Power & High-Resolution Audio Processing System LSI

LC823450
Partition Delete
PD
PD
470kΩ 1kΩ
SPI All Erase
PU
PU
470kΩ 1kΩ
SDCH0 All Erase PD
PD
1kΩ
1kΩ
QSPI All Erase
PU
PD
1kΩ
1kΩ
External ROM
Boot
PU
PD
470kΩ 470kΩ
Hi-z
PU
PU
1kΩ
1kΩ
After deleting IPL2 by using this mode, IPL2 can be written again while User
Area Boot mode.
Internal ROM boot(Partition Area IPL2 delete
–SD card I/F Ch0 + EXTINT2E + EXTINT2F)
After deleting IPL2 by using this mode, IPL2 can be written again while eMMC
Physical Boot mode.
Internal ROM boot(external Serial Flash SPI all area delete
–S-Flash I/F + EXTINT2E + EXTINT2F + TIOCB01)
Delete all content of Serial Flash. This mode should be used in case of SPI
mode operation of Serial Flash
Internal ROM boot(all area delete
–SD card I/F Ch0 + EXTINT2E + EXTINT2F)
Delete all content of eMMC including Partition area.
Take a lot of time to delete.
Trim also processed in case of eMMC supporting Trim function.
Internal ROM boot(external Serial Flash QSPI all area delete
–S-Flash I/F(QSPI) + EXTINT2E + EXTINT2F + TIOCB01)
Delete all content of Serial Flash. This mode should be used in case of QSPI
fetch mode operation of Serial Flash
External memory boot(External-0)
Fetch from external memory(External0) connected to XMC(external memory
controller)
External I/F ports below forced to Hiz
- EXA[20:1],EXD[15:0],NCS[1:0],NRD,NWRENWRL,NHBNWRH,NLBEXA0
- SDCLK0,SDCMD0,SDAT0[3:0]
- CK1,SDI1(QIO0),SDO1(QIO1),SWP1(QIO2),SHOLD1(QIO3),TIOCB01
 In case of TQFP128L, WLP154, don’t use external memory boot (External-0)
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