HN1B01FDW1T1 Datasheet, PDF (5/6 Pages) ON Semiconductor – Complementary Dual General Purpose Amplifier Transistor PNP and NPN Surface Mount

HN1B01FDW1T1
PACKAGE DIMENSIONS
SC−74
CASE 318F−05
ISSUE K
A
L
65 4
S
B
12 3
D
G
0.05 (0.002)
C
H
M
J
K
SOLDERING FOOTPRINT*
2.4
0.094
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM
LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F−01, −02, −03 OBSOLETE. NEW
STANDARD 318F−04.
INCHES
DIM MIN MAX
A 0.1142 0.1220
B 0.0512 0.0669
C 0.0354 0.0433
D 0.0098 0.0197
G 0.0335 0.0413
H 0.0005 0.0040
J 0.0040 0.0102
K 0.0079 0.0236
L 0.0493 0.0649
M
0_{_} 10_{_}
S 0.0985 0.1181
MILLIMETERS
MIN MAX
2.90 3.10
1.30 1.70
0.90 1.10
0.25 0.50
0.85 1.05
0.013 0.100
0.10 0.26
0.20 0.60
1.25 1.65
0_{_} 10_{_}
2.50 3.00
STYLE 3:
PIN 1. EMITTER 1
2. BASE 1
3. COLLECTOR 2
4. EMITTER 2
5. BASE 2
6. COLLECTOR 1
1.9
0.074
0.7
0.028
0.95
0.037
0.95
0.037
1.0
0.039
ǒ Ǔ _{SCALE 10:1}
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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