LC79451KB Datasheet, PDF (30/38 Pages) ON Semiconductor – Controller and Driver

9. PAD Assignment
9-1. PAD Assignment
No. 89
No. 90
No. 100
Alignment mark 2
LC79451KB
Y
X
(0,0)
SEG Driver pin
The others pin
No. 12
No. 11
No. 1
Alignment mark 1
No. 101
No. 115
Fig.11. PAD Assignment
No. 154
No. 168
Note: 1. Chip size (before dicing) X = 6.55 [mm] Y = 1.43 [mm] S = 9.37 [mm²]
2. Scribe line width
80 [μm]
3. Chip thickness
400±30 [μm]
Bump shape (Bump height = 17±3 [μm])
20μm 60μm
Alignment mark (No bump)
50μm
80μm
68μm
Fig.12. Gold bump shape
40μm
100μm
Fig.13. Alignment mark shape
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