CS1112 Datasheet, PDF (10/12 Pages) ON Semiconductor – Quad Power Output Driver

CS1112
PACKAGE DIMENSIONS
SO–24L
DW SUFFIX
CASE 751E–04
ISSUE E
24
1
–T–
SEATING
PLANE
–A–
13
–B– 12X P
0.010 (0.25) M B M
12
24X D
J
0.010 (0.25) M T A S B S
F
22X G
C
M
K
R X 45 _{_}
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 15.25 15.54 0.601 0.612
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G
1.27 BSC
0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M 0_{_} 8_{_} 0_{_} 8_{_}
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
PACKAGE THERMAL DATA
Parameter
R_ΘJC
R_ΘJA
Typical
Typical
SO–24L
9
55
Unit
°C/W
°C/W
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