MBT3946DW1T1G Datasheet, PDF (1/10 Pages) ON Semiconductor – Dual General Purpose Transistor

MBT3946DW1T1G
Dual General Purpose
Transistor
The MBT3946DW1T1G device is a spin−off of our popular
SOT−23/SOT−323 three−leaded device. It is designed for general
purpose amplifier applications and is housed in the SOT−363−6
surface mount package. By putting two discrete devices in one
package, this device is ideal for low−power surface mount
applications where board space is at a premium.
Features
• h_FE, 100−300
• Low V_CE(sat), ≤ 0.4 V
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
http://onsemi.com
(3)
(2)
(1)
Q₁
Q₂
(4)
(5)
(6)
MBT3946DW1T1*
*Q1 PNP
Q2 NPN
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector −Emitter Voltage
V_CEO
Vdc
(NPN)
40
(PNP)
−40
Collector −Base Voltage
V_CBO
Vdc
(NPN)
60
(PNP)
−40
Emitter −Base Voltage
V_EBO
Vdc
(NPN)
6.0
(PNP)
−5.0
Collector Current − Continuous
I_C
(NPN)
(PNP)
200
−200
mAdc
Electrostatic Discharge
ESD
HBM Class 2
MM Class B
THERMAL CHARACTERISTICS
Characteristic
Total Package Dissipation (Note 1)
T_A = 25°C
Thermal Resistance,
Junction−to−Ambient
Symbol
P_D
R_qJA
Max
150
833
Unit
mW
°C/W
Junction and Storage Temperature
Range
T_J, T_stg − 55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
recommended footprint.
1
SOT−363−6/SC−88
CASE 419B
STYLE 1
MARKING DIAGRAM
46 M G
G
46 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
MBT3946DW1T1G SC−88
(Pb−Free)
3000 /
Tape & Reel
MBT3946DW1T2G SC−88
(Pb−Free)
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
October, 2009 − Rev. 5
Publication Order Number:
MBT3946DW1T1/D