BCM856BS Datasheet, PDF (9/14 Pages) NXP Semiconductors – PNP/PNP matched double transistors

NXP Semiconductors
BCM856BS; BCM856DS
PNP/PNP matched double transistors
11. Packing information
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.^[1]
Type number Package Description
Packing quantity
3 000
10 000
BCM856BS SOT363 4 mm pitch, 8 mm tape and reel; T1
[2] _-115
-135
4 mm pitch, 8 mm tape and reel; T2
[3] _-125
-165
BCM856BS/DG SOT363 4 mm pitch, 8 mm tape and reel; T1
[2] _-115
-135
4 mm pitch, 8 mm tape and reel; T2
[3] _-125
-165
BCM856DS SOT457 4 mm pitch, 8 mm tape and reel; T1
[2] _-115
-135
4 mm pitch, 8 mm tape and reel; T2
[3] _-125
-165
BCM856DS/DG SOT457 4 mm pitch, 8 mm tape and reel; T1
[2] _-115
-135
4 mm pitch, 8 mm tape and reel; T2
[3] _-125
-165
[1] For further information and the availability of packing methods, see Section 15.
[2] T1: normal taping
[3] T2: reverse taping
12. Soldering
2.65
2.35 1.5 0.6 _0.5
(4×) _(4×)
0.4 (2×)
0.5
0.6
(4×)
(2×)
0.6
(4×)
1.8
Fig 13. Reflow soldering footprint SOT363 (SC-88)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot363_fr
BCM856BS_BCM856DS_1
Product data sheet
Rev. 01 — 7 August 2008
© NXP B.V. 2008. All rights reserved.
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