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TDA8594 Datasheet, PDF (45/48 Pages) NXP Semiconductors – I2C-bus controlled 4 X 50 W power amplifier | |||
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NXP Semiconductors
16. Mounting
TDA8594
I2C-bus controlled 4 à 50 W power ampliï¬er
2
1
27
26
hole diameter min. 0.92
â
0.08 M
1
2.54
2
Dimensions in mm sot878-1_fr
Dimensions in mm.
Reï¬ow soldering is the recommended soldering method.
Dimension â1â relates to dimension âe1â in Figure 38; dimension â2â relates to dimension âe2â in
Figure 38.
Fig 39. SOT878-1 reï¬ow soldering footprint
17. Abbreviations
Table 18. Abbreviations
Acronym
Description
ACK
ACKnowledge not
BCDMOS
Bipolar CMOS/DMOS
BTL
Bridge Tied Load
CMOS
Complementary Metal-Oxide Semiconductor
DMOS
Double-diffused Metal-Oxide Semiconductor
DSP
Digital Signal Processor
EMC
ElectroMagnetic Compatibility
ESR
Equivalent Series Resistance
LSB
Least Signiï¬cant Bit
MSB
Most Signiï¬cant Bit
NMOS
Negative-channel Metal-Oxide Semiconductor
PMOS
Positive-channel Metal-Oxide Semiconductor
PCB
Printed-Circuit Board
POR
Power-On Reset
SOAR
Safe Operating ARea
SOI
Silicon On Insulator
TDA8594_2
Product data sheet
Rev. 02 â 11 December 2007
© NXP B.V. 2007. All rights reserved.
45 of 48
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