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PHP30NQ15T Datasheet, PDF (3/13 Pages) NXP Semiconductors – N-channel TrenchMOS transistor
NXP Semiconductors
PHP30NQ15T
N-channel TrenchMOS standard level FET
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
VDS
VDGR
VGS
ID
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
IDM
peak drain current
Ptot
total power dissipation
Tstg
storage temperature
Tj
junction temperature
Source-drain diode
Tj ≥ 25 °C; Tj ≤ 175 °C
Tj ≥ 25 °C; Tj ≤ 175 °C; RGS = 20 kΩ
VGS = 10 V; Tmb = 25 °C; see Figure 1 and 2
VGS = 10 V; Tmb = 100 °C; see Figure 1
tp ≤ 10 µs; pulsed; Tmb = 25 °C; see Figure 2
Tmb = 25 °C; see Figure 3
IS
source current
ISM
peak source current
Avalanche ruggedness
Tmb = 25 °C
tp ≤ 10 µs; pulsed; Tmb = 25 °C
EDS(AL)S
non-repetitive
VGS = 10 V; Tj(init) = 25 °C; ID = 26 A; Vsup ≤ 25 V;
drain-source avalanche unclamped; RGS = 50 Ω; tp = 0.2 ms; see Figure 4
energy
IAS
non-repetitive
Vsup ≤ 25 V; VGS = 10 V; Tj(init) = 25 °C;
avalanche current
RGS = 50 Ω; unclamped; see Figure 4
Min Max Unit
-
150 V
-
150 V
-20 20
V
-
29
A
-
20
A
-
116 A
-
150 W
-55 175 °C
-55 175 °C
-
29
A
-
116 A
-
502 mJ
-
29
A
120
Ider
(%)
80
40
03aa24
103
ID
(A)
102
RDSon = VDS/ ID
10
D.C.
1
003aaa055
tp = 10 μs
100 μs
1 ms
10 ms
100 ms
0
0
50
100
150
200
Tmb (°C)
10−1
1
10
102
103
VDS (V)
Fig 1. Normalized continuous drain current as a
function of mounting base temperature
Fig 2. Safe operating area; continuous and peak drain
currents as a function of drain-source voltage
PHP30NQ15T_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 3 March 2010
© NXP B.V. 2010. All rights reserved.
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